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CorrMeas - Automated Wafer Inspection and Correlative Microscopy

CD Measurements with an AFM

CD measurements using an AFM present different challenges than those with a SEM. One advantage is that AFM images cannot be out of focus, so autofocus is unnecessary. However, the following challenges must be overcome:

These many challenges make the AFM the most hard to use high resolution non-destructive microscope type. The advantages are its height measurement capabilities and the possibility to measurer other physical effects like conductivity.

Image Acquisition

Because of the AFM's slow scanning speed, precise stage positioning is even more critical than in a SEM -- especially when reference structures are not visible in the optical microscope. AFMs cannot generate real overview scans; a typical maximum scan of 100 micrometers in width and height corresponds to a SEM magnification of about 1270 (referenced to a 5-inch polaroid film). Such large AFM scans take a long time and pose a risk to the tip, so they should be avoided. AFMs are most efficient at scan sizes below 10 micrometers. Cross-referencing using FFT, as done in SEMs or light microscopes, is not feasible for AFMs. For CD measurement using AFM, programmed position finding must be used. In many cases, full images are unnecessary -- only a few scan lines may be needed to measure the height or width of individual features.

While SEMs and light microscopes are good at measuring widths, AFMs are best suited for measuring height. The measured structure height in AFM images is minimally affected by tip-sample convolution. To obtain highly accurate, non-destructive results both in height and width, a combined SEM and AFM measurement of the same area is optimal. For such cases, a correlative automation platform like CorrMeas is especially useful, as it enables measurements of the same area by different instruments.

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